In modern electronics manufacturing, BGA PCB Assembly has become one of the most reliable and efficient packaging technologies for compact devices. With its ability to support high-pin-count components, improved thermal performance, and stable solder joints, it is widely used in communication equipment, consumer electronics, industrial control systems, and automotive electronics. As technology evolves toward miniaturization and high performance, companies like Shenzhen Fanway Technology Co., Ltd. provide advanced BGA PCB Assembly solutions that ensure optimal quality, precision, and durability.
BGA (Ball Grid Array) devices use solder balls arranged in a grid underneath the component instead of pins located on the perimeter. This structural difference brings several key advantages:
Higher connection density
Better electrical conductivity
Enhanced heat dissipation
Superior performance stability
Reduced risk of solder bridging
This technology is especially valuable when your product requires more robust signal integrity and tighter packaging than conventional SMD components can deliver.
The application of BGA PCB Assembly significantly boosts overall device performance. Its hidden solder balls shorten electrical paths, lowering resistance and improving signal transmission speed. Moreover, the larger contact area of solder balls enhances heat conduction, allowing high-power chips and processors to remain stable during long-term operation. For industries requiring reliable and compact electronics, this assembly method becomes indispensable.
Key Performance Benefits:
Lower impedance and improved high-frequency performance
Strong mechanical connection for vibration-resistant applications
Excellent thermal management
เพิ่มความสามารถในการประมวลผลสำหรับ CPU, GPU และ IC
Below is an overview of the manufacturing parameters supported by Shenzhen Fanway Technology Co., Ltd. for BGA PCB Assembly.
1. Assembly Capability Overview
| Parameter Category | Specification |
|---|---|
| Package Types | BGA, ไมโคร BGA, CSP, LGA, QFN |
| Ball Pitch | 0.25 mm – 1.27 mm |
| Min. PCB Thickness | 0.4 mm |
| Max. PCB Size | 510 mm × 510 mm |
| Assembly Types | Leaded / Lead-free BGA |
| Inspection Method | X-ray, AOI, Functional Testing |
| Rework Capability | การถอด BGA การรีบอล การเปลี่ยน |
2. Soldering & Inspection Parameters
Reflow Temperature Control: ±1°C accuracy
อัตราช่องว่าง: < 10% (ปรับให้เหมาะสมสำหรับแอปพลิเคชันระดับพรีเมียม)
Coplanarity Tolerance: < 0.1 mm
Alignment Precision: ±20 μm
Placement Accuracy: Up to 01005 components supported alongside BGA
3. PCB Material Compatibility
FR4 High-Tg
Polyimide (PI)
Rogers high-frequency boards
Hybrid multilayer PCBs
HDI boards with blind/buried vias
These parameters ensure stable, repeatable, and high-precision assembly for even the most complex BGA projects.
Industries that require precision, durability, and high component density consistently choose BGA PCB Assembly because it ensures:
Minimal signal delay
Long-term thermal stability
Strong mechanical bonding
Low failure rate under continuous operation
Excellent EMC performance
Industries Widely Applying BGA PCB Assembly:
เครื่องใช้ไฟฟ้า (สมาร์ทโฟน แท็บเล็ต แล็ปท็อป)
Industrial control equipment
อิเล็กทรอนิกส์ยานยนต์และระบบนำทาง
Medical electronics
Network communication devices
Aerospace and defense electronics
Shenzhen Fanway Technology Co., Ltd. offers tailored BGA solutions to meet these demanding industry conditions.
Reliability depends heavily on process control, inspection technology, and engineering expertise. We employ:
Quality Control Measures:
Automated Optical Inspection (AOI)
Detects slight misalignment, solder defects, and component orientation issues.
X-ray Inspection
จำเป็นสำหรับข้อต่อบัดกรีที่ซ่อนอยู่ภายใต้แพ็คเกจ BGA
Checks for voids, bridging, insufficient solder, and open connections.
Reflow Profiling Optimization
Ensures solder balls fully melt and form uniform connections.
Professional Rework Technology
วิศวกรของเราสามารถเปลี่ยน เปลี่ยนลูกบอล และจัดเรียงส่วนประกอบ BGA ได้อย่างปลอดภัยโดยไม่ทำให้ PCB เสียหาย
These techniques ensure every board meets global quality standards such as IPC-A-610 and ISO9001.
The true value of BGA PCB Assembly lies in its ability to help engineers design products that are:
Smaller
Faster
More energy-efficient
More reliable under harsh conditions
Because BGA packages sit directly above solder balls, electrical pathways shorten and resistance reduces. This structure is ideal for products requiring fast data processing or compact internal layout. For example, devices using CPUs, memory chips, Bluetooth modules, or advanced networking ICs greatly benefit from BGA assembly.
เพื่อให้มั่นใจถึงประสิทธิภาพสูงสุด วิศวกรควรประเมิน:
Design Considerations:
Adequate pad diameter
Proper solder mask design
Via-in-pad structure if necessary
PCB heat distribution
Reflow curve configuration
Suitable material and layer count
Production Considerations:
The precision of placement equipment
X-ray inspection capability
ประสบการณ์ด้านวิศวกรรมกับการออกแบบที่มีความหนาแน่นสูง
Rework and repair capability
Shenzhen Fanway Technology Co., Ltd. provides comprehensive engineering support, helping you optimize layout, reduce assembly risk, and improve manufacturing yield.
คำถามที่ 1: BGA PCB Assembly คืออะไร และเหตุใดจึงใช้กันอย่างแพร่หลาย
A: BGA PCB Assembly is a method of mounting Ball Grid Array components onto printed circuit boards using solder balls arranged underneath the package. It is widely used because it provides high-density connections, stable electrical performance, and excellent heat dissipation, which are essential for modern compact electronic devices.
Q2: How does BGA PCB Assembly improve the reliability of my product?
A: Its structure creates strong mechanical connections and improves thermal conduction. These factors reduce failure rates, enhance performance stability, and allow the PCB to operate efficiently under continuous high-load conditions.
คำถามที่ 3: จำเป็นต้องมีการตรวจสอบอะไรบ้างในระหว่างการประกอบ BGA PCB
A: X-ray inspection is mandatory to verify hidden solder joints. AOI and functional testing are also recommended to ensure alignment accuracy, proper soldering, and electrical performance.
Q4: Can Shenzhen Fanway Technology Co., Ltd. handle complex BGA PCB Assembly projects?
A: Yes. We support fine-pitch BGA, Micro-BGA, CSP, and HDI boards with advanced precision placement, reflow control, X-ray testing, and rework capabilities, making us a reliable partner for full-range BGA assembly services.
If your project requires stable, high-precision, and high-performance BGA PCB Assembly, our engineering team is ready to support your development from prototyping to mass production.
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